AMD CEO Dr. Lisa Sue has said that Moore’s Law is not dead yet and innovations such as chiplets and 3D chip packaging technology will help overcome the challenges. In addition, he emphasized in this interview that AMD is moving towards entering the 2nm world.
Moore’s Law is still alive, but it has slowed down
Dr. Lisa Su, CEO of AMD, at An interview with Barron’s He pointed out that Moore’s Law is still alive, but slower than before, and that things must be done differently to overcome performance, efficiency and cost challenges. AMD has pioneered the advancement of chiplet and 3D packaging technology with its first HBM designs in 2015, chiplet processors in 2017, as well as the first 3D packaging on a chip with its 3D V-Cache design in 2022.
Moore’s Law was proposed by Intel co-founder Gordon Moore in 1965 (or 1975 as the story goes), stating that the number of transistors doubles every year. Gordon Moore passed away on March 24th, but his legacy lives on in the tech world with Intel and AMD still living under his law. But unlike AMD, Nvidia believes that Moore’s Law has run out of gas and is no longer applicable to its business strategy.
|Gordon Moore, founder of Intel and creator of Moore’s Law, has died|
AMD’s CEO says that chiplets and 3D packaging are solutions he’s invested in today, and we should expect to hear more in the future. The company plans to launch its MI300 chip, a true exa-scale APU that combines different CPU, GPU, and memory IPs in multiple chiplets and 3D formats in a unique package. Of course, this is a giant chip and will be launched later this year as a leader in artificial intelligence.
I would certainly say that I don’t think Moore’s Law is dead. I think Moore’s Law has slowed down. We have to do different things to continue that performance and energy efficiency. We launched chiplets – that was a big step. We now do 3D packaging. We think there are a number of other innovations as well. Software and algorithms are also very important. I think you need all of these pieces for us to continue on this executive path that we’ve all been on.
AMD CEO, Dr. Lisa Sue
Rising costs won’t stop AMD from moving to the 2nm process
Ms. Lisa also pointed out that they will continue to move forward despite increasing cost and reducing the generation-to-generation performance advantage of each node of the transmission process. AMD says it’s currently working on 3nm, and they’re currently looking at 2nm processes and beyond. In a similar strategy, this leads to the Angstrom or sub-nanometer era, starting with 20A and 18A on Intel’s side.
Yes. Transistor costs and the improvement you get in overall power density and reduction are lower than any other generation. But we are still moving forward from generation to generation. We’re doing a lot of things at 3nm today, and we’re looking beyond that to 2nm. But we’ll continue to use chiplets and these kinds of constructions to get around some of the challenges of Moore’s Law.
AMD CEO, Dr. Lisa Sue
Currently, AMD has products that use 5nm and 4nm process nodes, and even a few 6nm and 7nm products in between. But starting next year, the company is expected to introduce its first 3nm chips, which will likely be targeted specifically at servers before the company makes them available to the general consumer market.
It should be noted that many PC companies have delayed orders for products based on TSMC’s 3nm node due to the current market conditions, and AMD is also said to be involved. It will be interesting to see what nodes AMD will use for their next generation CPU/GPU/APU architectures, as TSMC has a wide range of manufacturing processes based on what they announced in their recent roadmap.
- AMD will launch Ryzen 7040 Phoenix processors in late April
- First benchmark of an AMD Zen 5 processor in the CBR R23
- Very high voltage on AMD Ryzen 7000 processor when idle
- Specifications of three mid-range AMD RX 7000 series graphics cards have been leaked