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Intel roadmap for leading the chip industry by 2025

نقشه راه اینتل برای پیشتاز شدن در صنعت تراشه سازی تا سال ۲۰۲۵

With the new management, Intel intends to regain the leading position in the chip manufacturing industry, which it had for decades, and to become a leader in this industry by 2025. Want to know what Intel plans to do to return to its golden age?

Of course, Intel has a difficult path to regain its position. To achieve this, the company must spend tens of billions of dollars to make up for the mistakes made. Patrick P. Pat Gelsinger, Intel’s new CEO, acknowledged at the event that the company is accelerating investment in manufacturing processes and the acquisition of innovative technologies. Gelsinger says Amazon is Intel’s first major customer to use the company’s foundry-based solutions for its web services. Qualcomm is also a customer of the Intel Angstrom 20A or Intel Angstrom 20A process. Gelsinger also pointed out that Intel’s past competitors may be its future customers!

Gelsing has acknowledged that Intel Foundry Services (IFS) is ending all competition. Intel has recently unveiled a highly detailed approach to the manufacturing process and packaging technology for use in its chip factories. Packaging technology refers to a process that creates a link between processes related to the production of a product and processes related to supply and distribution. The giant has also introduced its innovative technologies that will be used in its products until 2025.

Intel has outlined its plans to move towards the design and production of a new generation of chips, ultraviolet lithography, also known as the ultraviolet lithographic aperture.

Intel will be the first company to acquire ultraviolet lithography production tools. Gelsinger said this at the Intel Global Webcast (Intel Accelerated).

We are working to achieve Intel’s unrivaled lead based on advanced packaging techniques. We are accelerating the process of creating and developing our innovative technologies to make sure we are on the right track to achieving our lead in 2025. We are using our innovative and unique methods to achieve advanced technologies.

As long as Mendeleev’s table is able to continue, we will follow Moore’s law relentlessly, as well as our path to innovative technologies, using the magic of silicon. Undoubtedly, after years of backwardness, Intel needs to take the initiative to return to its desired position.

David Kanter, a technology analyst and president of Real World Insight, believes that Intel has not been in place for the past three or four years and has been focusing more on forward-looking technologies and using them to build new products. Most experts believe that in order for chips to evolve and change their performance, there must be a revolution in transistor architecture.

RibbonFET and PowerVia technologies

RibbonFET and PowerVia technologies

Intel has also unveiled two amazing new chip technologies, RibbonFET and PowerVia. RibbonFET is actually the implementation of Intel’s desired changes in the transistor gate to connect to all transistor channels and is a new architecture. This new architecture is the first architecture designed by Intel after the leading FinFat architecture in 2011.

This technology increases the switching speed of the transistors as well as achieving the same amount of transmission conduction in the transistor fins in a smaller space. PowerVia is a unique method designed by Intel to transmit power to the chip from the back, which no longer requires the power path to be specified in front of the chip, and the signal is transmitted more efficiently.

Intel is coming up with amazing innovative ways to get the most out of Intel 20A technology. These innovative methods are the same as RibbonFET and PowerVia technologies.

According to Kanter, PowerVia is the most unique technology and can be said to be one of the most prominent examples of sophisticated technologies because it is used to support power transmission.

Intel has also stated that it intends to take the lead in 3D chip design by using the technologies used to build Foveros Omni and Foveros Direct (3D chip design allows chips to be produced exactly as they are ultimately produced). Be designed)

Intel’s strategy is based on three principles: first, to focus on factories to produce some of the domestic products needed, such as microprocessors; second, to build a team to design the chips needed by foreign companies;

New naming for processing nodes

Processing nodes

Intel is making a huge breakthrough in what engineers refer to as marketecture. This word is a combination of marketing and architecture. This word is considered for any form of architecture that is created solely for sale. Intel is changing the way it names its manufacturing processes, making naming more consistent with other parts of the industry, and providing accurate information about the different types of chips produced at each stage of production.

Sanjay Natarajan, head of Intel’s Logical Model Development Group, who joined Intel after becoming CEO of Gelsinger, acknowledged that Intel had not disclosed its confidential information on such a large scale, and said in an interview that Gelsinger had already Has identified the need to be welcomed in the chip manufacturing industry worldwide.

Many years ago, physical measurements of transistor gates were common; But measuring specific parts has long been discontinued and forgotten, and now more size is being used as a label to introduce technology. Intel’s 10nm chip rivals the TSMC 7nm chip. Intel is also preparing the “Angstrom Age” semiconductor components, and the Angstrom, which is actually a unit of measurement of 0.1 nanometers (every 10 angstroms is one nanometer), could be used to introduce the various nodes produced in the next few generations.

Intel seems to be more honest in naming processor nodes than Samsung and TSMC; But there is still no industry standard to compare these nodes. Intel has long realized that the node-based nanometer unit measurement system is no longer appropriate and, like the 1997 gate length measurement system, should be discontinued. Intel has introduced a new naming structure for its processing nodes and seeks to provide a clear and consistent framework for providing more accurate information about processing nodes to the company’s customers.

Another important step by Intel to become a leader in the chip industry is the launch of a new service called Intel Foundry Services, which allows the company to build and customize chips to exactly what customers want and need, and in fact customize them. Cast according to customer request.

Intel 7, Intel 4 and Intel 3

Intel 7, Intel 4 and Intel 3

Intel 7 is one of Intel’s new names for the manufacturing process. Intel seems to have made the name for competing chips such as the 7-nanometer TSMC chip. The power of the Intel 7 has increased by 10 to 15 percent per watt compared to the previous generation (10-nanometer fintech chip). The 10nm FitFat chip is based on FinFET transistor optimization processes.

The Intel 7 will be used in 12th generation Intel Alder Lake processors, which will be available to clients in 2021, and will also be used in the Sapphire Rapid server processor for data centers. Ambassador Rapid has not been released yet and is expected to launch in the first quarter of next year.

Intel 4 also supports ultraviolet lithography so that it can use very short wavelengths of light to print very small details. The chip’s ultraviolet light also increases its power by about 20 percent per watt. Intel 4 is expected to be ready for production in the second half of next year and will be launched in 2023 on processors such as Meteor Lake for clients and Granite Rapid for data centers. Intel 4 seems to perform better than similar TSMC models.

Intel 3 focuses more on optimizing fin-fin transistors and ultraviolet lithography to increase its performance compared to Intel 4 by 18% per watt, and it is possible to improve its performance even more. Production of Intel 3 chips will begin in the second half of 2023.

The Age of Angstrom

The Age of Angstrom

Intel 20A process. It marks the beginning of the Angstrom era (the letter A is the first letter of the word Angestrom) in which Intel is set to show off its power to its rivals with two technologies, RibbonFET and PowerVia.

The Intel 20A process will be officially launched in 2024 and will be used in the production process, and the Intel 18A process will start in 2025; Therefore, in 2024 and 2025, we will see the production of chips with sizes of 2 and 1.8 nanometers by Intel.

Intel plans for 2025 watches and beyond

Intel chip

As we said, Intel intends to implement the Intel 18A process from 2025. Implementing this process, which is made possible by modifying and modifying the RibbonFET architecture, significantly enhances transistor performance. The company is also working to design, build, manufacture and develop the next generation of ultraviolet numerical aperture chips and is expected to be the first company in the world to acquire the tools to manufacture such chips.

Intel is working closely with ASML to ensure that Intel succeeds in this amazing field of transcending the production of ultraviolet lithographic chips.

Intel has a long and illustrious track record of using innovative technologies that have accelerated the company’s growth. Intel was one of the first companies to start producing 90-nanometer chips, followed by the production of 45-nanometer die-cast metal gates with high kappa, and then the production of 22-nanometer fintech transistors.

The Intel 20A process, with its RibbonFET architecture and PowerVia transmission technology, could be another high-performance Intel propulsion engine. Intel’s new packaging model, IDM 2.0, is another of Intel’s strategic plans for the company’s design and manufacturing advances, and provides the potential for other third-party companies to take advantage of its foundry capabilities.

Intel acknowledges that embedded multi-die interconnect bridge (EMIB) technology is the first 2.5-dimensional internal communication technology that can be used to easily connect different components together, reducing chip size and ultimately manufacturing costs. . This technology has been used in products that have been available since 2017.

Ambassador Rapid, the Xeon processor, will be the first mass-produced EMIB processor. It is also the first processor to be the size of a dual astronomical camera network, and its performance is almost at the level of processors designed with an integrated test design language. The next generation of EMIB songs will be 45 microns instead of 55 microns.

Foveros is another attractive powerful chip of Intel’s future with 3D backdoor technology. The 36-micron Meteor Lake processor is the second generation of the chip to be used in client products.

Foveros chip

The Foveros Omni chip is the second generation of the Foveros chip and is expected to have a modular design and an internal die-to-die connection. The chip is expected to reach mass production in 2023. Foveros Direct is another chip in this family that will be less than 10 microns in size, and Intel will use 3D stack technology to reduce its size and increase the density of internal connections. This chip is also produced and marketed as Foveros Direct McNell chip.

Intel is also working with many leading chip companies in the United States and Europe to consolidate its lead in the future of the chip industry so that they can shift their efforts from concept design to mass production. Inel, meanwhile, has pledged to work with various governments to strengthen the supply chain, as well as steer the economy and national security in the right direction.

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