Samsung unveils GDDR6W graphics RAM with double bandwidth and performance

Samsung unveils GDDR6W graphics RAM with double bandwidth and performance

Samsung It has recently unveiled its next generation graphics memory named GDDR6W and it seems that the performance and capacity of this new RAM has been doubled compared to GDDR6 DRAM. In this regard, Samsung has stated that with the development of advanced graphic and visual technologies, the border between reality and the computer world of the Metaverse is fading, and many of these important changes in this field have been made possible by the advancement of graphics memory for graphic products.

In this regard, one of the main challenges regarding graphics processors is the use of visual realities of the real world and its recreation and transformation in the computer graphics space. In this regard, Samsung has stated that successful performance of this task requires a large and high-speed memory as well as adequate computing power. The company also sees the benefits of running a true and widespread metaverse as very useful, acknowledging that as its infrastructure develops, it will spark new innovations and the emergence of other technologies.

Using FOWLP packaging and increasing bandwidth

To meet the needs and demand of the market in this field, Samsung developed the new generation GDDR6W x64 graphics memory, and this product is based on GDDR6 x32 technology. The new RAM also comes with FOWLP chip packaging technology, which will greatly increase bandwidth and memory capacity. Since the release of the GDDR6 RAM series, significant improvements have been reported in this regard, and in June of this year, the Korean giant introduced a newer memory of the same technology with a speed of 24 Gbps, which was dubbed the fastest graphics DRAM at the time.

Samsung GDDR6W

Now Samsung’s new GDDR6W RAM is supposed to offer twice the bandwidth and performance while being the same size and scale as GDDR6. Thanks to relatively few changes and the use of FOWLP, the new memory chips can be produced and delivered to customers using the same manufacturing process used for GDDR6, saving time and reducing manufacturing costs for Samsung.

As shown in the picture and since the capacity can be doubled in the same physical scale, the capacity of the new graphics DRAM has increased from 16Gb to 32Gb, while the bandwidth and I/O interface have also increased from 32 to 64 has changed. In other words, the area required for memory has been reduced by 50% compared to previous models. In general, the final size and scale of the chip increases with the placement of more chips, but there are also physical factors in this field that create limitations in this regard.

Samsung GDDR6W

In addition, placing the chips on top of each other also increases the capacity, but it will not work properly in the field of heat and heat. In this regard, to overcome these problems, Samsung has used FOWLP chip packaging technology to develop new GDDR6W graphics RAMs. Instead of installing the memory die on the PCB, this technology installs it directly on the silicon wafer, and to do this, the Redistribution Layer (RDL) technology is used with better wiring support.

Samsung GDDR6W

Since the PCB is no longer involved, package thickness is reduced and heat dissipation capabilities are improved. While the semiconductor industry has continuously chosen scalable methods for IC development, chip packaging has also become more important as the physical limit of the chip is reached. For this reason, Samsung has used 3D IC packaging technology for GDDR6W RAMs, where a single package can create different types of chips directly on the wafer.

Samsung has also stated that this is one of the innovations it has planned to make the advanced GDDR6W packaging faster and more efficient. New GDDR6W graphics RAM technology can deliver HBM’s high system-level bandwidth, and the fastest DRAM on the planet, HBM2E, delivers 1.6TB/s/s system-level bandwidth with I/O support and 3.2Gbps transfer rate per pin. makes available while Samsung’s new RAM can achieve system-level bandwidth of 1.4TB/s with support for 22Gbps per pin.

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