SK Hynix company recently and during the 70th International Solid Disk Circuits Conference (ISSCC) information about 8th generation of its own 3D NAND chips Has published with more than 300 active layers. The company’s presentation at the conference, titled “High-Density Memory and High-Speed Interfaces,” explains how the company has been able to increase the performance of its SSD chips while reducing production costs. The new chips of this company will come to the market in two years and will change the records of this field.
The eighth generation of 3D NAND chips from SK Hynix
SK Hynix’s 8th generation 3D NAND chips offer up to 1 TB (128 GB) capacity, 20 Gbit/mm2 density, 16 KB page size and up to 2400 Mbit/s interface bandwidth with three-layer structure. The maximum data transfer speed of these chips reaches 194 MB/s, which is 18% higher than the seventh generation 238-layer chips of this company with a speed of 164 MB/s. Thanks to the PCIe 5.0 x4 interface, the accelerated speed of data transfer from these chips goes even higher.
As SK Hynix’s new chips are still in the development phase, it is not yet clear when mass production will begin. According to the information that the company released at the ISSCC 2023 event, mass production or limited production of these chips with the cooperation of partners is much closer than we expected.
SK Hynix has not yet announced its roadmap and timing for the release of its new generation of 3D NAND chips. However, we expect the company’s 8th generation chips to hit the memory market in 2024 at best and 2025 at best. The only problem that might delay the mass production or supply of these chips are unforeseen developments that could seriously disrupt the supply chain and put SK Hynix or its partners in big trouble.
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