Qualcomm is preparing to introduce a weaker version of the Snapdragon 888 chipset and will likely produce it without a 5G integrated modem. Another report states that the company will probably work with Leica to produce a replacement version of the Snapdragon 888.
Yesterday we told you in a report about the SM8325 chip that it will probably be used for cheap flagship phones and we still do not know how different it is from the Snapdragon 870. Roland Quandt in another report today Says Qualcomm has begun testing early versions of the SM8450 chipset, which will probably be called Waipio. This product will probably be introduced at the end of 2021 and should be the main successor to Snapdragon 888.
The company is currently testing a chip with 12GB of LPDDR5 RAM and 256GB of internal storage. The chip’s camera capabilities are likely to be greatly enhanced, and Qualcomm has reportedly partnered with German lens company Leica. Current experiments appear to focus on a module known internally as Leica1.
Qualcomm is currently building the Snapdragon 888 in partnership with Samsung, but will likely return to TSMC to build its next-generation chip with a 4-nanometer manufacturing process.
Quandt also announced the existence of an intermediate chip with the model number SM7325. The chip has a 2.7 GHz processing core, three 2.4 GHz cores and four 1.8 GHz cores. The SM7325 currently supports up to 12 GB of LPDDR5 RAM and 256 GB of UFS 3.1 internal storage, but the final product may be compatible with up to 16 GB of RAM.
Qualcomm is also developing another mid-range chip called the Snapdragon 775, which uses model number SM7350 and is manufactured with a 5nm manufacturing process.