TSMC’s 3nm nodes perform better than expected and Intel’s CPU order delays

TSMC's 3nm nodes perform better than expected and Intel's CPU order delays

According to a new report published by DigiTimes, it seems that performance TSMC’s 3nm nodes have exceeded expectations And according to the latest published information, Intel has apparently postponed orders for the 15th generation Arrow Lake processors until 2024. TSMC started mass production of its 3nm N3 chips in the fourth quarter of 2022, and now, based on early reports, the performance of the new chips has exceeded expectations.

The initial results, being stable in other chips, also allow the manufacturing company to introduce its technology as the top 3nm manufacturing technology in the global market. Apple is one of the main customers of 3nm chips and will apparently pay more for 3nm chips than 5nm. However, Apple is going to use these chips in its high-end phones, and the final price may not be very effective for Apple, but in any case, PC component manufacturers may see the greatest impact in this regard, and in this regard, the market demand as well. Reduced for PC hardware.

In this regard, it has been said that Intel is going to choose a new foundry to manufacture the 15th generation Intel Arrow Lake iGPU CPUs with integrated graphics processor support. The 15th generation Arrow Lake processor series is going to be released after Intel’s Meteor Lake chips, and Intel has made many changes to its products in the 15th generation.

TSMC's 3nm node performance

While the Meteor Lake processor sockets will be compatible on the same Meteor Lake platform, but the processing cores of this generation are going to be completely upgraded to the new generation of Lion Cove and Skymont. It is expected that the increase of the cores of this series of processors will also affect the increase of their final performance.

Intel has also surprisingly abandoned the use of its Intel 4 nodes and will directly use its 20A nodes for Arrow Lake. Both the Meteor Lake and Arrow Lake chip series will likely be built using TSMC’s N3 nodes to take advantage of the additional core IPs.

Intel’s 20A nodes will feature RibbonFET and PowerVia tech, which will increase performance by 15% per watt, and the first batch of these wafers is expected to be ready in mid-to-late 2023.

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